+44 (0) 1506 443058   |   Component cleaning and fluids. Soldering products.

High Reliability Solder Pastes that perform

The Koki range of solder pastes includes products that solve your particular challenges, from pillowing and bridging to poor wetting and voiding. We can assist you with selecting lead–free, leaded or halogen-free solder pastes with the required process performance and cleanability. The aim: repeatable solder joint quality and reliability.

Cleanable-no-clean lead free solder paste

koki-m501-solder-paste

Cleanliness test

Cleanliness test

Koki S3X58-A230* solder paste provides exceptional cleanable, no clean performance, leaving behind no trace of flux residues on PCBs.

  1. Unique properties successfully assure sufficient tack time of 24 hours.
  2. Offers maximum flexibility by being suitable for both clean and no-clean use.

*Leaded versions also available offering even higher cleanability and lower melting points.

S3X58-A230 is ideal for soldering applications requiring:

  • Anti-pillow
  • Very easy clean no-clean
  • Low voiding
  • Lead free (leaded versions available)
  • >24-hours tack time
  • Fine-pitch/ultra-fine pitch

pdf-icon Koki S3X58-A230*

*Leaded versions also available offering even higher cleanability and lower melting points.

Remarkable wetting, anti-pillow, very low voiding

Koki-m500c-5

Remarkable wetting

Koki S3X58-M500C-5 anti-pillow lead-free solder paste provides powerful wetting to severely oxidised pads or components such as oxidized Cu substrate, oxidized Sn and NiPd plating.

  1. In tests, S3X58-M500C-5 demonstrated much longer heat durability of up to 50 seconds. In contrast, conventional solder paste lost activation in less than 30 seconds once it had started to melt.
  2. Delivers perfect melting and wetting performance at super fine pitch (>0.4mm pitch) and with micro components (>0.30mm diameter CSP, 0603 chip).

S3X58-M500C-5 is ideal for soldering applications requiring:

  • Ultra-low voiding
  • Anti-pillow
  • Powerful wetting
  • Lead free
  • Halide-free
  • Cleanable no-clean
  • >48-hours tack time
  • Fine-pitch/ultra-fine pitch

Halogen Free with Outstanding wetting performance

koki-s3x48-a230-solder-paste

Outstanding wettability

unrivalled wetting power koki
Compared to conventional pastes, S3X58-M501 has outstanding wetting power

halogen freeKoki S3X58-M501 uses new technology that stabilises activators, resulting in unprecedented powerful wetting. Activator also lets air bubbles in the molten solder escape easily, for low voiding.

  1. Halogen-free formulation in response to the increasing demand in automotive and other sectors.
  2. Activator used in S3X58-M501 retains its clear colour even after being heated at 250ºC, contributing to leaving clear flux residue.

S3X58-M501 is ideal for soldering applications applications requiring:
• Anti-pillow
• High wettability
• Low voiding
• Halogen-free
• Cleanable no-clean/clear residues
• Fine-pitch/ultra-fine pitch

Outstanding printability solder paste

Koki solder paste M406L-3

Koki S3X58-M406L-3 is specially engineered to ensure outstanding continual printability with super-fine pitch (0.4mm/16mil) and CSP (>0.25mm dia.) applications, and long stencil idle time.

  1. Offers perfect melting and wetting with ultra-fine-pitch and micro-components, as well as powerful wetting with metals including alloy42 and nickel.
  2. Very low voiding with CSPs and broad contact components assured by specially formulated flux chemistry.

S3X58-M406L-3 is ideal for soldering applications requiring:

  • • Excellent printability
    • Anti-pillow formulation
    • High wettability
    • Lead-free
    • Halide-free
    • >72-hours tack time
    • Long stencil abandonment time >90 mins
    • Fine-pitch/ultra-fine pitch

Also available S3X58-M406ECO which does not require refrigerated storage

ICT compatible residue Solder Paste

koki-s3x48-a230-solder-paste
S3X58-M650-7 solder paste

halogen freeKoki S3X58-M650-7 solder paste provides exceptional cleanable, no clean performance, leaving behind no trace of flux residues on PCBs.

  1. Special flux residue remains flexible after reflow to prevent clogging of ICT test probe pins

S3X58-M650-7 is ideal for soldering applications applications requiring:

  • Anti-pillow
  • ICT test probe compatible residue, doesn’t clog the test probe
  • Very well suited to being conformally coated
  • Low voiding
  • Long stencil abandonment time
  • >24-hours tack time
  • Fine-pitch/ultra-fine pitch

Low melting point solder paste

Koki solder paste M406L-3
Comparison of PCBs condition after reflow
Comparison of PCBs condition after reflow

halogen freeKoki TB48/TAB58-M742 solder paste provides outstanding wetting and low voiding performance using a low melting point alloy

  1. Reflow oven temperatures can be kept to a minimum to protect temperature sensitive components and boards.
  2. Reduced oven temperatures significantly reduce CO2 emmissions due to reduced power consumption during processing

TB48-M742 is ideal for soldering applications applications requiring:

  • Anti-pillow
  • Halogen Free
  • Melting point 138-140 degC
  • Low voiding
  • Suitable for PET substrate
  • >24-hours tack time
  • Dispensable version also available TB48-M742D
  • Reduced power consumption resulting in reduced CO2 emissions

Easy Clean-no-clean leaded solder paste

koki-s3x48-a230-solder-paste

Cleanliness test

aniti-tombstone leaded alloy paste

Koki SE/SS58-A230 solder paste provides exceptional cleanable, no clean performance, leaving behind no trace of flux residues on PCBs.

  1. Cleanable using both aqueous and solvent based cleaning processes
  2. Offers maximum flexibility by being suitable for both clean and no-clean use.

SE/SS58-A230 is ideal for soldering applications requiring:
• Anti-pillow
• Very easy clean no-clean in both aqueous and solvent cleaning systems
• Low voiding
• Leaded alloy with unique, modern, up to date flux chemistry (lead free versions also available)
• Available as SE (standard Eutectic) and SS (with 2% silver) alloys
• >24-hours tack time
• Fine-pitch/ultra-fine pitch

*Unleaded versions also available (see above information)

Anti-tombstone leaded alloy solder paste

Koki solder paste M406L-3

Solder Wetting

Solder wetting

 Koki SSA48-M955 solder paste provides cleanable, no clean performance, with alloy designed to address tombstoning issues regularly associated with leaded alloys and in particular vapour phase reflow

  1. Cleanable using both aqueous and solvent based cleaning processes
  2. Offers maximum flexibility by being suitable for both clean and no-clean use.

SSA48-M955 is ideal for soldering applications requiring:

  • Anti-pillow
  • Anti tombstone alloy
  • Easy clean no-clean in both aqueous and solvent cleaning systems
  • Low voiding
  • Lead-free (leaded versions available)
  • >24-hours tack time
  • Fine-pitch/ultra-fine pitch