Component cleaning equipment and fluids | Soldering products

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High Reliability Solder Pastes that perform

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We can guide you expertly through the new generation of soldering products from KOKI, a global leader in soldering product innovation, including leaded and unleaded solder pastes, fluxes, wires and adhesives for today’s high-temperature applications.

The Koki range of solder pastes includes products that solve your particular challenges, from pillowing and bridging to poor wetting and voiding. We can assist you with selecting lead–free, leaded or halogen-free solder pastes with the required process performance and cleanability. The aim: repeatable solder joint quality and reliability.

 

koki-m501-solder-paste

Cleanliness test

Cleanliness test

Cleanable-no-clean lead free solder paste

Koki S3X58-A230* solder paste provides exceptional cleanable, no clean performance, leaving behind no trace of flux residues on PCBs.

  1. Unique properties successfully assure sufficient tack time of 24 hours.
  2. Offers maximum flexibility by being suitable for both clean and no-clean use.

*Leaded versions also available offering even higher cleanability and lower melting points.

Koki-m500c-5

Remarkable wetting

Remarkable wetting, anti-pillow, very low voiding

Koki S3X58-M500C-5 anti-pillow lead-free solder paste provides powerful wetting to severely oxidised pads or components such as oxidized Cu substrate, oxidized Sn and NiPd plating.

  1. In tests, S3X58-M500C-5 demonstrated much longer heat durability of up to 50 seconds. In contrast, conventional solder paste lost activation in less than 30 seconds once it had started to melt.
  2. Delivers perfect melting and wetting performance at super fine pitch (>0.4mm pitch) and with micro components (>0.30mm diameter CSP, 0603 chip).

S3X58-A230 is ideal for soldering applications requiring:

  • Anti-pillow
  • Very easy clean no-clean
  • Low voiding
  • Lead free (leaded versions available)
  • >24-hours tack time
  • Fine-pitch/ultra-fine pitch

pdf-icon Koki S3X58-A230*

*Leaded versions also available offering even higher cleanability and lower melting points.

S3X58-M500C-5 is ideal for soldering applications requiring:

  • Ultra-low voiding
  • Anti-pillow
  • Powerful wetting
  • Lead free
  • Halide-free
  • Cleanable no-clean
  • >48-hours tack time
  • Fine-pitch/ultra-fine pitch
koki-s3x48-a230-solder-paste

Outstanding wettability

unrivalled wetting power koki
Compared to conventional pastes, S3X58-M501 has outstanding wetting power

Halogen Free with Outstanding wetting performance

halogen freeKoki S3X58-M501 uses new technology that stabilises activators, resulting in unprecedented powerful wetting. Activator also lets air bubbles in the molten solder escape easily, for low voiding.

  1. Halogen-free formulation in response to the increasing demand in automotive and other sectors.
  2. Activator used in S3X58-M501 retains its clear colour even after being heated at 250ºC, contributing to leaving clear flux residue.
Koki solder paste M406L-3

Outstanding printability solder paste

Koki S3X58-M406L-3 is specially engineered to ensure outstanding continual printability with super-fine pitch (0.4mm/16mil) and CSP (>0.25mm dia.) applications, and long stencil idle time.

  1. Offers perfect melting and wetting with ultra-fine-pitch and micro-components, as well as powerful wetting with metals including alloy42 and nickel.
  2. Very low voiding with CSPs and broad contact components assured by specially formulated flux chemistry.

S3X58-M501 is ideal for soldering applications applications requiring:
• Anti-pillow
• High wettability
• Low voiding
• Halogen-free
• Cleanable no-clean/clear residues
• Fine-pitch/ultra-fine pitch

S3X58-M406L-3 is ideal for soldering applications requiring:

  • • Excellent printability
    • Anti-pillow formulation
    • High wettability
    • Lead-free
    • Halide-free
    • >72-hours tack time
    • Long stencil abandonment time >90 mins
    • Fine-pitch/ultra-fine pitch

Also available S3X58-M406ECO which does not require refrigerated storage

koki-s3x48-a230-solder-paste
S3X58-M650-7 solder paste

ICT compatible residue Solder Paste

halogen freeKoki S3X58-M650-7 solder paste provides exceptional cleanable, no clean performance, leaving behind no trace of flux residues on PCBs.

  1. Special flux residue remains flexible after reflow to prevent clogging of ICT test probe pins
Koki solder paste M406L-3
Comparison of PCBs condition after reflow
Comparison of PCBs condition after reflow

Low melting point solder paste

halogen freeKoki TB48/TAB58-M742 solder paste provides outstanding wetting and low voiding performance using a low melting point alloy

  1. Reflow oven temperatures can be kept to a minimum to protect temperature sensitive components and boards.
  2. Reduced oven temperatures significantly reduce CO2 emmissions due to reduced power consumption during processing

S3X58-M650-7 is ideal for soldering applications applications requiring:

  • Anti-pillow
  • ICT test probe compatible residue, doesn’t clog the test probe
  • Very well suited to being conformally coated
  • Low voiding
  • Long stencil abandonment time
  • >24-hours tack time
  • Fine-pitch/ultra-fine pitch

TB48-M742 is ideal for soldering applications applications requiring:

  • Anti-pillow
  • Halogen Free
  • Melting point 138-140 degC
  • Low voiding
  • Suitable for PET substrate
  • >24-hours tack time
  • Dispensable version also available TB48-M742D
  • Reduced power consumption resulting in reduced CO2 emissions

 

koki-s3x48-a230-solder-paste

Cleanliness test

aniti-tombstone leaded alloy paste

Easy Clean-no-clean leaded solder paste

Koki SE/SS58-A230 solder paste provides exceptional cleanable, no clean performance, leaving behind no trace of flux residues on PCBs.

  1. Cleanable using both aqueous and solvent based cleaning processes
  2. Offers maximum flexibility by being suitable for both clean and no-clean use.
Koki solder paste M406L-3

Solder Wetting

Solder wetting

Anti-tombstone leaded alloy solder paste

 Koki SSA48-M955 solder paste provides cleanable, no clean performance, with alloy designed to address tombstoning issues regularly associated with leaded alloys and in particular vapour phase reflow

  1. Cleanable using both aqueous and solvent based cleaning processes
  2. Offers maximum flexibility by being suitable for both clean and no-clean use.

SE/SS58-A230 is ideal for soldering applications requiring:
• Anti-pillow
• Very easy clean no-clean in both aqueous and solvent cleaning systems
• Low voiding
• Leaded alloy with unique, modern, up to date flux chemistry (lead free versions also available)
• Available as SE (standard Eutectic) and SS (with 2% silver) alloys
• >24-hours tack time
• Fine-pitch/ultra-fine pitch

*Unleaded versions also available (see above information)

SSA48-M955 is ideal for soldering applications requiring:

  • Anti-pillow
  • Anti tombstone alloy
  • Easy clean no-clean in both aqueous and solvent cleaning systems
  • Low voiding
  • Lead-free (leaded versions available)
  • >24-hours tack time
  • Fine-pitch/ultra-fine pitch

koki-officesAbout KOKI

Established for over 50 years, Tokyo-based KOKI Corporation has been pioneering and manufacturing cutting-edge soldering materials ever since, growing to become a truly global player.

Part of that growth was spearheaded by the establishment in 2001 of KOKI Europe in Denmark, for whom Fraser Technologies is sole UK partner.

Today, we work hand in hand with KOKI to offer our electronics industry customers technically advanced products that deliver high performance, and compliance with environmental legislation.

Specialist applications

KOKI is actively advancing next generation soldering technologies such as halogen-free flux, anti-cracking solder alloys and low-melting-point solder alloys, alongside its existing suite of high-quality soldering materials.

The Koki suite of soldering products also provides solutions for specialist applications, including:

  • Residue-less soldering
  • Jet dispensing/high speed dispensing
  • Test probe compatible residues
  • High reliability applications such as those demanded by the aerospace, defence and automotive industries
  • PoP paste applications
  • High-density SMT packages.
  • Laser soldering
  • Environmental testing resistant residues
  • SMT Adhesives

Please ask your Fraser Technologies adviser for guidance on your specialist soldering or component cleaning requirements.