One of the most significant challenges in the electronics industry is the formation of voids in solder joints. Voiding typically occurs when flux or solvent in the paste becomes trapped in the joint, or paste oxidises, and empty spaces are created within the joint. Too many voids in a solder joint will impact the joint’s reliability, so it’s important this issue is avoided.
Examples of high levels of voiding within a solder joint
Because there in an increasing use of power transistor components in surface mount electronics, the reflow discharge of generated gas, and the subsequent voiding, is becoming a more critical issue with these larger-sized components.
Koki, our partner for soldering solutions, has developed S3X58-G803, which is a lead-free, ultra-low voiding solder paste. But what does that mean, and what sets it apart from other solder pastes?
How does S3X58-G803 reduce solder joint voiding?
The G803 solder paste is engineered so the oxide reduction reaction occurs before the solder melts or during pre-heating stage.
Koki G803 solder paste void reduction technique
Then a very fast solder wetting action discharges flux gas as the solder melts. This means that almost no non-wet locations are left, no flux remains in the joint and there is no continuous outgassing. No flux trapped in the joint means the opportunity for voiding to take place is significantly reduced.
This formula ensures stable and consistently low voiding, regardless of the metallisation condition of the component or PC board; the type or shape of the components; or the reflow profiles.
Another benefit of G803 is consistent, continual printability with fine pitch component board pad patterns. And in terms of electronic compatibility, a heat-resistant flux activator system enables good solder coalescence with micro-components, even under harsh reflow profiles.
How does S3X58-G803 compare to other solder pastes?
As the below image illustrates, the G803 solder paste significantly reduces voiding compared to similar products.
G803 voiding results within a solder joint
G803 also has powerful wetting performance, which combats another common challenge in the electronics industry of poor wetting paste, and in turn increases soldering speed. A balance of both important capabilities creates an overall high quality of performance, and reliable effectivity in use.