Solving solder wire challenges with Koki’s 72M series

Similarly to other industrial sectors, electronics manufacturers are always looking for solutions to ongoing issues and more efficient production methods.

One such demand is the need for more cost-effective solder wires. Typically, standard un-leaded solder alloys used for hand soldering wires are very aggressive and ‘eat’ soldering iron tips. As components get smaller due to design and space limitations, soldering iron tips have become more sophisticated and much more expensive…

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One of the most significant challenges in the electronics industry is the formation of voids in solder joints. Voiding typically occurs when flux or solvent in the paste becomes trapped in the joint, or paste oxidises, and empty spaces are created within the joint. Too many voids in a solder joint will impact the joint’s reliability, so it’s important this issue is avoided.

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If you’re struggling with oxidised pads and components, combat the challenge with Koki’s S3X58-M500C-7 powerful wetting, no-clean solder paste

Most engineers and operators have experienced poor solder wetting – an extremely common challenge in the electronics industry. Poor wetting can be caused by a number of different issues including low paste volume or inconsistent soldering temperatures, but mostly this is due to oxidisation or tarnishing of the solder joints caused by poorly stored or very old components, often referred to as ‘grey’ components…

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