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The cleaning of PCB assemblies can be performed using either aqueous or solvent based processes. These depend on a range of parameters (safety, chemistry, cleaning process, environment, substrate and soil type) as well as PCB design and reflow temperatures. Types of flux residue vary from process to process and even no-clean fluxes leave a residue. No single chemistry proves the answer for every situation. The aim is to achieve consistently clean PCB surfaces and under-component areas, free for unwanted flux and other residues – for reliability and repeatability. 

Assembly cleaning processes using aqueous cleaning chemistries include 

  • aqueous batch cleaning – spray in air
  • aqueous batch cleaning – immersion
  • aqueous inline cleaning 

Stencil cleaning using dedicated automatic equipment complements other stencil cleaning methods, including under-stencil wiping and manual or semi-auto cleaning to help avoid unwanted residue on stencils that can lead to print problems and defects.  There are 4 main automatic cleaning processes:

  • immersion ultrasonic cleaning, water rinse
  • Immersion ultrasonic cleaning, no rinse
  • Spray-in-air, water rinse
  • Spray in air, no rinse

Fraser Technologies can help ensure compatibility between chemistries, processes and equipment to ensure optimal cleaning results. New challenges are always on the horizon, and our aim is to meet the changing needs of the electronics sector and help deliver cost effective, safety-conscious and eco-friendly solutions.

NEW Miele PLW 6011 & PLW 6111

The single chamber aqueous cleaning system is only 65cm wide, providing a large internal capacity within a small footprint. It offers a flexible chamber space, allowing a wide range of components to be cleaned quickly at the same time.

The machines are especially effective for flux removal from electronic PCB assemblies but are ideally suited for many other specialist cleaning applications as well.

  • Smart load system for maximum user flexibility
  • Intelligent controls – 40 programmable slots controlled through an integrated touch glass screen
  • Efficient cleaning processes and high-grade stainless steel finish give enhanced longevity and reliability, with maximum particulate removal ensured by HEPA H14 fine filter
  • Easy visual monitoring of chamber via full glass door and integrated chamber lighting
  • Wide range of load carriers and 93 available accessories offer complete configurability for any size of load (up to 50L) offering maximum flexibility alongside ease of use

Application: electronics

  • Soldering flux removal
  • Unpopulated, populated or misprinted circuit boards and ceramic substrates
  • Soldering frames, soldering masks and metal templates

Types of soiling:

  • Milling dust, solder paste, flux residues and SMT adhesives

Cleaning requirements:

  • Before populating
  • After soldering
  • After printing
  • Before circuit tests
  • Before lacquering
  • After misprinting.

Application: Medical, glass and optical ware

  • Coated and uncoated glass, e.g. moulded glass, safety glass, optical lenses

Types of soiling:

  • Dust, glass dust, fingerprints, particles, lapping abrasives, polish, wax crayon

Cleaning requirements:

  • Interim or final clean
  • Before and after coating

Application: metal components

  • Steel, stainless steel aluminium, copper, brass, diecast zinc, hard alloys

Types of soiling

  • Oil, emulsions, polishes, metal particles, lapping abrasives

Cleaning requirements:

  • Interim or final clean
  • Before assembling or packing
  • Before sticking, lacquering, welding, soldering
  • Before setting
  • Before coating (e.g. TiN and TiC)

Application: 3D printing and plastics

  • Plastic components, magazines and transport containers

Types of soiling:

  • Separating agent, dust, particles, oil

Cleaning requirements:

  • Interim or final clean
  • Before assembly or packing.

Aquatronic P Range

aquatronic

We specify and supply the Aquatronic P range of aqueous ultrasonic multistage cleaning systems. These systems are available in three models – P1, P2 and P3 – with progressively higher levels of automation.

Processes typically comprise stages such as an ultrasonic clean, agitation via spray under immersion, water rinse, de-ionised water rinse and drying.

aquatronic-p1

The Aquatronic P1 is our entry level aqueous multistage ultrasonic cleaning system. Designed for light to medium production volumes.

Advantages of Aquatronic P1 at a glance:

  • Ultrasonic cleaning
  • Powerful spray jets
  • Hot air dryer
  • Extraction
  • PLC controlled.

aquatronic

The Aquatronic P2 is our mid-range aqueous multistage ultrasonic cleaning system. Designed for medium production volumes.

 

Advantages of Aquatronic P2 at a glance:

  • Upper tank enclosure with automatic door
  • Ultrasonic cleaning
  • Powerful spray jets
  • Hot air dryer
  • Extraction
  • PLC controlled
  • Full colour touch screen HMI
  • Remote access and diagnostics
  • Stylish LED notification.

aquatronic-p3

The Aquatronic P3 is our flagship multi-stage, aqueous cleaning system. Designed for medium to high production volumes.

Advantages of Aquatronic P3 at a glance:

  • Automatic load and unload conveyor beds
  • Fully automated
  • Sealed upper canopy
  • Ultrasonic cleaning
  • Powerful spray jets
  • Hot air dryer
  • Extraction
  • PLC controlled
  • Full colour touch screen HMI
  • Remote access and diagnostics
  • Stylish LED notification system.
Fraser Technologies