Follow us on Linkedin
High Reliability Solder Pastes that perform
The Koki range of solder pastes includes products that solve your particular challenges, from pillowing and bridging to poor wetting and voiding. We can assist you with selecting lead–free, leaded or halogen-free solder pastes with the required process performance and cleanability. The aim: repeatable solder joint quality and reliability.
High performance halogen free solder paste
Koki’s recently updated S3X58-HF1100-3 Halogen Free solder paste provides a powerful wetting performance equivalent to halogen containing solder pastes whilst complying with Halogen Free standard (Cl+Br = 0ppm): BS EN14582
- Exhibits excellent print quality.
- >1 hour stencil idle time.
- Drastically reduces flux splattering.
Koki S3X58-HF1100-3 Halogen Free solder paste is ideal for applications requiring::
- Powerful wetting
- ICT testing/compatibility
- Low flux splattering
- NEW pin in paste applicable
- Low voiding
- Excellent printing
- Extended tack time
- Electrical reliability
Cleanable-no-clean lead free solder paste
Cleanliness test
Koki S3X58-A230* solder paste provides exceptional cleanable, no clean performance, leaving behind no trace of flux residues on PCBs.
- Unique properties successfully assure sufficient tack time of 24 hours.
- Offers maximum flexibility by being suitable for both clean and no-clean use.
*Leaded versions also available offering even higher cleanability and lower melting points.
S3X58-A230 is ideal for soldering applications requiring:
- Anti-pillow
- Very easy clean no-clean
- Low voiding
- Lead free (leaded versions available)
- >24-hours tack time
- Fine-pitch/ultra-fine pitch
*Leaded versions also available offering even higher cleanability and lower melting points.
Remarkable wetting, anti-pillow, very low voiding
Koki S3X58-M500C-5 anti-pillow lead-free solder paste provides powerful wetting to severely oxidised pads or components such as oxidized Cu substrate, oxidized Sn and NiPd plating.
- In tests, S3X58-M500C-5 demonstrated much longer heat durability of up to 50 seconds. In contrast, conventional solder paste lost activation in less than 30 seconds once it had started to melt.
- Delivers perfect melting and wetting performance at super fine pitch (>0.4mm pitch) and with micro components (>0.30mm diameter CSP, 0603 chip).
Outstanding printability solder paste
Koki S3X58-M406L-3 is specially engineered to ensure outstanding continual printability with super-fine pitch (0.4mm/16mil) and CSP (>0.25mm dia.) applications, and long stencil idle time.
- Offers perfect melting and wetting with ultra-fine-pitch and micro-components, as well as powerful wetting with metals including alloy42 and nickel.
- Very low voiding with CSPs and broad contact components assured by specially formulated flux chemistry.
S3X58-M406L-3 is ideal for soldering applications requiring:
- • Excellent printability
• Anti-pillow formulation
• High wettability
• Lead-free
• Halide-free
• >72-hours tack time
• Long stencil abandonment time >90 mins
• Fine-pitch/ultra-fine pitch
Also available S3X58-M406ECO which does not require refrigerated storage
ICT compatible residue Solder Paste
Koki S3X58-M650-7 solder paste provides exceptional cleanable, no clean performance, leaving behind no trace of flux residues on PCBs.
- Special flux residue remains flexible after reflow to prevent clogging of ICT test probe pins
S3X58-M650-7 is ideal for soldering applications applications requiring:
- Anti-pillow
- ICT test probe compatible residue, doesn’t clog the test probe
- Very well suited to being conformally coated
- Low voiding
- Long stencil abandonment time
- >24-hours tack time
- Fine-pitch/ultra-fine pitch
Low melting point solder paste
Koki TB48/TAB58-M742 solder paste provides outstanding wetting and low voiding performance using a low melting point alloy
- Reflow oven temperatures can be kept to a minimum to protect temperature sensitive components and boards.
- Reduced oven temperatures significantly reduce CO2 emmissions due to reduced power consumption during processing
TB48-M742 is ideal for soldering applications applications requiring:
- Anti-pillow
- Halogen Free
- Melting point 138-140 degC
- Low voiding
- Suitable for PET substrate
- >24-hours tack time
- Dispensable version also available TB48-M742D
- Reduced power consumption resulting in reduced CO2 emissions
Anti-tombstone leaded alloy solder paste
Solder Wetting
Koki SSA48-M955 solder paste provides cleanable, no clean performance, with alloy designed to address tombstoning issues regularly associated with leaded alloys and in particular vapour phase reflow
- Cleanable using both aqueous and solvent based cleaning processes
- Offers maximum flexibility by being suitable for both clean and no-clean use.
SSA48-M955 is ideal for soldering applications requiring:
- Anti-pillow
- Anti tombstone alloy
- Easy clean no-clean in both aqueous and solvent cleaning systems
- Low voiding
- Lead-free (leaded versions available)
- >24-hours tack time
- Fine-pitch/ultra-fine pitch
As experts in the field, Fraser Technologies have a deep understanding of the challenges and opportunities facing our clients’ industries and sectors. Our insights and independent recommendations are based on over 55 years experience, and rigorous analysis of the options available to you.
